Soldering

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Soldering is a non-fusion joining process which uses capillary action to draw a filler material into the joint to form a bond. The properties of the joint are not the same as the parent metal. Soldering uses a filler material which melts below 450oC, and often as low as 300oC.[1]

References

  1. http://www.bocindustrial.co.uk/bocindustrial/technical/glossary/a.asp

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